Centre for Sensors, Instruments and Systems Development

Universitat Politècnica de Catalunya

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Optical design and simulation
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Encapsulation process
Plastic optics
HYPTRONICS
CNM
MINECO
ERDF

Project

Development of a new industrial process for the encapsulation of electro-optical devices for distributed information systems bandwidth.

Principal investigator

Jaume Pujol Ramo [+info]

Summary

This project aims to develop a new industrial process using ultrasound for encapsulating electro-optical devices to be used in distributed information systems with large bandwidth. The main competitive advantage and overcoming the state of contemporary art that this new process provides regarding current systems is summarized in two points:
 
  • The use of ultrasounds improves the current manufacturing process by reducing process times.
  • Improved final performance through improved power margin.

The two lines of improvement described, become the products resulting from this industrial process unique in the market as a cheaper and better performance than any other competing product. It is important to note that the improvements that have been described above have been quantified with a forecast to reduce manufacturing costs by up to 30% compared to current market and as to the best techniques are expected to improve 4 dB.

Validation of the corresponding versions of this process in the different possible environments, enable participating entities in the consortium positioned advantageously in various links of the value chain of communications technologies on plastic optical fiber, a market segment strong growth expected in the future.

This project will develop different encapsulation processes in order to improve the functional characteristics of the LED / detectors and lower processing costs. Encapsulations commonly used for molding the optical part require relatively high amounts of thermosetting materials, which must additionally endure, after the molding process and after removing the encapsulated component from the cavity, a curing process, often in a oven for 4-5 hours at high temperature. The main objective is to replace this curing process by a molding process of thermoplastic injection using ultrasounds.

It arises therefore a technical alternative for broadband communications and low latency in so-called extreme environments that support demanding operational conditions at a reduced price. The answer to this problem is the plastic optical fiber. Its flexibility is very remarkable, the price is reduced, although its characteristics as a means of transmission are still to be improved. In this regard, this project sets a technological development that will enable a large bandwith and low latency communications network with a high degree of reliability even in harsh environments. Specifically, it is proposed to develop a new encapsulation process for plastic fiber that meets the requirements to it.

Partners

AGENCIA ESTATAL CONSEJO SUPERIOR DE INVESTIGACIONES CIENTIFICAS (CSIC) INSTITUTO DE MICROELECTRONICA DE BARCELONA - CENTRO NACIONAL DE MICROELECTRONICA (IMB-CNM) [+info]

HYBTRONICS MICROSYSTEMS. S.A. (HYBTRON)

MINISTERIO DE ECONOMÍA Y COMPETITIVIDAD (MINECO) [+info]

External links

HYBtronics Microsystems, S.A.

IMB-CNM, CSIC (Instituto de Microelectrónica de Barcelona - Centro Nacional de microelectrónica)

Ministerio de Economía y Competitividad

Extranet
CD6 Centre for Sensors, Instruments and Systems Development
Rambla de Sant Nebridi, 10  ·  08222  ·  Terrassa (Barcelona)