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ENCAP - Encapsulation of electro-optical devices

Under the funding program Reto-Collaboration (RTC-2015-3954-8) of the Ministry of Economy and Competitiveness, the Project ENCAP developed by the National Centre for Microelectronics of the CSIC, the company Hybtronics Microsystems, and CD6 from the Technical University of Catalonia, under the direction of Dr. Josep Arasa, enters in its second year for the development of a new industrial process for the encapsulation of electro-optical devices. During these first 12 months of the project, it has been carried out successfully the first proof of concept of the process. The test consisted in the encapsulation of a LED that will be used for high bandwidth optical communications.